Wafer level packaging using flip chip mounting
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United States of America Patent
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Dec 4, 2012
Grant Date -
Sep 30, 2010
app pub date -
Jun 25, 2008
filing date -
Nov 30, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor packaged device, and method of packaging that incorporates the formation of cavities about electronic devices during the packaging process. In one example, the device package includes a first substrate having a first recess formed therein, a second substrate having a second recess formed therein, and an electronic device mounted in the first recess. The first and second substrates are joined together with the first and second recesses substantially overlying one another so as to form a cavity around the electronic device.
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