Head gimbal assembly having a load beam aperature over conductive heating pads that are offset from head bonding pads
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United States of America Patent
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-
Dec 4, 2012
Grant Date -
N/A
app pub date -
Jun 14, 2012
filing date -
May 27, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A novel head gimbal assembly (HGA) for use in a disk drive is disclosed. Each of a plurality of electrically conductive traces of a flexure of the HGA includes a connection region that is aligned with and connected to a corresponding one of a plurality of electrically conductive bonding pads of a head. Each of the plurality of electrically conductive traces further includes a heating pad that is offset from its connection region by an offset distance. A dielectric layer of the flexure includes a first opening over the heating pad, a support layer of the flexure includes a second opening over the heating pad, and a load beam of the HGA includes a third opening disposed over the heating pad. During assembly, light may be shined through the openings and onto the heating pad until solder located in the connection region that is offset from the heating pad melts.
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