Miniature MEMS condenser microphone packages and fabrication method thereof
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United States of America Patent
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Dec 4, 2012
Grant Date -
Jul 22, 2010
app pub date -
Jan 19, 2010
filing date -
Jan 20, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.
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