Hearing apparatus chip with a separate EMC ground and corresponding hearing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8325953
APP PUB NO 20090123008A1
SERIAL NO

12291687

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Abstract

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A Hearing apparatuses and a hearing apparatus chip are provided. A hearing apparatus chip for processing a signal of a hearing apparatus includes a signal-processing component and a first ground wire connected to a first terminal of the component. The signal processing component includes a second ground wire galvanically separated from the first ground wire on the chip and is connected to a second terminal of the component by way of a capacitor, in order to conduct interference signals as a result of electromagnetic couplings. In particular, the sensitive ground of a preamplifier is not then interfered with by leakage currents.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS MEDICAL INSTRUMENTS PTE LTDSINGAPORE 139959

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dickel, Thomas Buttenheim, DE 10 99
Gottschalk, Georg Erlangen, DE 6 68
Kasztelan, Thomas Bestensee, DE 22 158

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