Heat-expandable microspheres and a process for producing the same

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United States of America Patent

PATENT NO 8329298
APP PUB NO 20090176098A1
SERIAL NO

12067771

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Abstract

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A method that heat-expandable microspheres includes the use of a shell of thermoplastic resin and a non-fluorine blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin. The method includes, a step of dispersing an oily mixture containing a polymerizable component, the blowing agent, and a polymerization initiator containing a peroxydicarbonate in an aqueous dispersing medium to polymerize the polymerizable component contained in the oily mixture. The resultant heat-expandable microsphres have a shell which is less apt to become thinner than its theoretical value, contain minimum amount of resin particle inside their shell, and have excellent heat-expanding performance.

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Patent Owner(s)

Patent OwnerAddress
MATSUMOTO YUSHI-SEIYAKU CO LTD1-3 SHIBUKAWA-CHO 2-CHOME YAO-SHI OSAKA 5810075 ?5810075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoki, Takayuki Yao, JP 83 596
Inohara, Takeshi Yao, JP 9 72
Kitano, Kenichi Yao, JP 67 668
Masuda, Toshiaki Yao, JP 69 779
Miki, Katsushi Yao, JP 26 204

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