Integrated circuit package having a plurality of spaced apart pad portions
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 11, 2012
Grant Date -
N/A
app pub date -
Dec 9, 2004
filing date -
Jun 10, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully