Method of forming electrode placement and connection systems
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United States of America Patent
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Dec 18, 2012
Grant Date -
Apr 15, 2010
app pub date -
Oct 8, 2009
filing date -
Oct 10, 2008
priority date (Note) -
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Abstract
Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.
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