Insulating aperture in printed circuit boards
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United States of America Patent
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-
Dec 18, 2012
Grant Date -
Nov 18, 2010
app pub date -
Jan 31, 2008
filing date -
Jan 31, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.
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