Thin wafer chuck

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8336188
APP PUB NO 20100013169A1
SERIAL NO

12175359

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.

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Patent Owner(s)

  • FORMFACTOR, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Kuan Yong Singapore, SG 1 156
Monteen, Bjorn San Jose, US 4 161

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