Mechanical tape separation package and method
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United States of America Patent
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Dec 25, 2012
Grant Date -
N/A
app pub date -
Oct 27, 2010
filing date -
Oct 27, 2010
priority date (Note) -
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Abstract
A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.
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