Stackable plasma cleaned via package and method
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United States of America Patent
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Dec 25, 2012
Grant Date -
N/A
app pub date -
Jul 30, 2010
filing date -
Jul 30, 2010
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a contamination is formed on the interconnection balls. The contamination is removed using a plasma cleaning process. By removing the contamination, robust reflow of the interconnection balls is insured thus maximizing yield. Further, the plasma cleaning process is a cost efficient high volume process with no adverse effect on package reliability.
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