Thermally assisted recording head with near field transducer having integral heatsink
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United States of America Patent
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-
Dec 25, 2012
Grant Date -
Mar 1, 2012
app pub date -
Aug 31, 2010
filing date -
Aug 31, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A write head structure for use with thermally assisted recording is disclosed. Improved heat sinking is provided for removing thermal energy created by a ridge aperture near field light transducer. Metal films conduct heat away from the region near the ridge aperture to the high pressure air film at the ABS between the head and media. This heat is further dissipated by the media. The metal films have varying thickness to improve lateral conductivity and may be composed of Au combined with a harder metal such as Ru to improve wear characteristics at the ABS.
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