Device for placing a component on a substrate
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United States of America Patent
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Jan 1, 2013
Grant Date -
Oct 14, 2010
app pub date -
Apr 13, 2010
filing date -
Apr 14, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.
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