Abrasive tool for use as a chemical mechanical planarization pad conditioner
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United States of America Patent
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Jan 1, 2013
Grant Date -
Sep 30, 2010
app pub date -
Dec 31, 2009
filing date -
Mar 24, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.
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