Apparatus for ejecting fluid onto a substrate and system and method incorporating the same
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United States of America Patent
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Jan 1, 2013
Grant Date -
Sep 8, 2011
app pub date -
May 10, 2011
filing date -
Jul 21, 2006
priority date (Note) -
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Abstract
A method of processing a substrate. In one embodiment, the invention can be a method of processing a substrate comprising: supporting the substrate in a horizontal orientation; rotating the substrate; providing a fluid dispensing apparatus adjacent a surface of the substrate, the fluid dispensing apparatus comprising a body having an outer surface and a first conduit terminating as a first hole in the outer surface of the body and a second conduit terminating as a second hole in the outer surface of the body, the first hole oriented at a non-normal angle relative to the substrate and offset a first radial distance from a rotational center-point of the substrate; and ejecting liquid out of the first hole into contact with the substrate at the rotational center-point and ejecting liquid out of the second hole into contact with the substrate at a second radial distance from the rotational center-point.
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