Automated thermal slide debonder
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 1, 2013
Grant Date -
Jun 23, 2011
app pub date -
Dec 22, 2010
filing date -
Dec 23, 2009
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.
First Claim
Family
International Classification(s)
- B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B65G:TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR L....
- B65H:HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- B66C:CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRAN....
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