Method to arrange features on a substrate to replicate features having minimal dimensional variability
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United States of America Patent
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Jan 8, 2013
Grant Date -
Apr 8, 2004
app pub date -
Oct 4, 2002
filing date -
Oct 4, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is directed to a method of and a mold for arranging features on a substrate to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate. It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material on the substrate. Thereafter, a plurality of features is formed in a region of the flowable material. The plurality of features are arranged to provide a substantially uniform fill factor in the region.
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