Semiconductor device including electronic component coupled to a backside of a chip
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United States of America Patent
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Jan 8, 2013
Grant Date -
Mar 26, 2009
app pub date -
Sep 21, 2007
filing date -
Sep 21, 2007
priority date (Note) -
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Abstract
A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.
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