Analyte sensors comprising high-boiling point solvents
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United States of America Patent
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Jan 15, 2013
Grant Date -
May 26, 2011
app pub date -
Nov 24, 2009
filing date -
Nov 24, 2009
priority date (Note) -
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Abstract
Generally, embodiments of the present disclosure relate to analyte determining methods and devices (e.g., electrochemical analyte monitoring systems) that have improved uniformity of distribution of the sensing layer by inclusion of a high-boiling point solvent, where the sensing layer is disposed proximate to a working electrode of in vivo and/or in vitro analyte sensors, e.g., continuous and/or automatic in vivo monitoring using analyte sensors and/or test strips. Also provided are systems and methods of using the, for example electrochemical, analyte sensors in analyte monitoring.
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