Chip resistor and method of manufacturing the same
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United States of America Patent
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Jan 15, 2013
Grant Date -
Jan 27, 2011
app pub date -
Jul 20, 2010
filing date -
Jul 27, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.
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