Method and product for cutting materials
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United States of America Patent
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Jan 22, 2013
Grant Date -
Aug 5, 2010
app pub date -
Feb 3, 2010
filing date -
Feb 3, 2009
priority date (Note) -
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Abstract
The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 μm or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.
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