Surface mount electronic device packaging assembly
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United States of America Patent
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-
Jan 22, 2013
Grant Date -
Dec 9, 2010
app pub date -
Jun 1, 2010
filing date -
Jun 1, 2009
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mount electronic device packaging assembly includes a body having an aperture defined therethrough. The aperture is adapted to receive an electronic device therein. The body has a first surface and a second surface. An electrically conductive contact pad is disposed on the first surface of the body. The contact pad is adapted to receive a lead from the electronic device. A thermally conductive base pad is disposed on the second surface of the body. A top surface of the base pad is adapted to receive the electronic device thereon.
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