Substrate attenuator circuit
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United States of America Patent
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-
Jan 22, 2013
Grant Date -
Jul 7, 2011
app pub date -
Sep 29, 2010
filing date -
Jan 7, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is a substrate attenuator circuit having a thin, long conductive pattern with a plurality of bends on a substrate, with heat generation per unit area reduced to a small amount even at a low attenuation level. A linear conductive pattern configured to have a plurality of bends on a substrate is provided with output terminals at n portions thereof. The conductive pattern has a larger line width at a first stage conductive pattern portion defined in a portion from an input terminal to m output terminals (m
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