Method for manufacturing liquid ejecting head
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United States of America Patent
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-
Jan 29, 2013
Grant Date -
Jun 5, 2008
app pub date -
Oct 30, 2007
filing date -
Oct 31, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing a liquid ejecting head that has a channel forming substrate and a reservoir forming substrate is provided. The method includes forming a vibration plate on the channel forming substrate, a piezoelectric element on the vibration plate removing portions of the vibration plate to form first and second opening portions, forming a lead electrode extending from the piezoelectric element including a first separate metal layer disposed over the first opening portion and a second separate layer disposed on the second opening portion, attaching a reservoir forming substrate to the channel forming substrate, forming a communicating portion in the channel forming substrate with a first positioning hole corresponding to the first opening portion and a second positioning hole corresponding to the second opening portion, and communicating the reservoir portion and the communicating portion by removing the separate metal layers.
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