Ultra high speed signal transmission/reception
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United States of America Patent
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Jan 29, 2013
Grant Date -
Oct 20, 2011
app pub date -
Apr 13, 2010
filing date -
May 8, 2007
priority date (Note) -
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Abstract
There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.
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