Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
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United States of America Patent
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Jan 29, 2013
Grant Date -
Jul 21, 2011
app pub date -
Mar 29, 2011
filing date -
Aug 28, 2007
priority date (Note) -
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Abstract
Semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a method of manufacturing a semiconductor device includes forming a plurality of first side trenches to an intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes removing material from a second side of the molded portion at areas aligned with the first side trenches, wherein removing the material forms openings through the molded portion. The method further includes forming a plurality of electrical contacts at the second side of the molded portion at the openings and electrically connecting the second side contacts to corresponding bond-sites on the dies.
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