Integrated circuit package and method of forming an integrated circuit package
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United States of America Patent
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Jan 29, 2013
Grant Date -
N/A
app pub date -
Oct 27, 2009
filing date -
Oct 27, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package is described. The integrated circuit package comprises a substrate having a plurality of sides, where each pair of adjacent sides forms a corner; a die coupled to a first surface of the substrate; a lid having a first portion positioned over the die and a plurality of foot portions, each foot portion of the plurality of foot portions being coupled to the first surface of the substrate at a corresponding corner of the substrate, where a side of the integrated circuit package above the substrate and between two associated foot portions has an opening; and a plurality of contact elements coupled to a second surface of the substrate. A method of forming an integrated circuit package is also shown.
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