Method for optimized removal of wafer from electrostatic chuck

United States of America Patent

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Jan 29, 2013
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Aug 19, 2010
app pub date
Feb 17, 2009
filing date
Feb 17, 2009

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Abstract

Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.

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Patent Owner	Address
INTEVAC INC	3560 BASSETT STREET SANTA CLARA CA 95054

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H01T:SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS....

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Inventor Name	Address	# of filed Patents	Total Citations
Bluck, Terry	Santa Clara, US	86	5256
Grimard, Dennis	Ann Arbor, US	12	810
Sahibudeen, Hizam	Woodlands, SG	1	102

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Method for optimized removal of wafer from electrostatic chuck

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12372664

048635-037000

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PATENT NO	8363378
APP PUB NO	20100208409A1
SERIAL NO	12372664
DOCKET NO	048635-037000

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 29, 2013	US,8363378,B2 US8363378B2	GRANTED PATENT AS SECOND PUBLICATION
August 19, 2010	US,20100208409,A1 US20100208409A1	FIRST PUBLISHED PATENT APPLICATION

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12372664

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