Assembly to provide thermal cooling
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United States of America Patent
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Jan 29, 2013
Grant Date -
Mar 15, 2012
app pub date -
Sep 13, 2010
filing date -
Sep 13, 2010
priority date (Note) -
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Abstract
In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.
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