Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

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United States of America Patent

PATENT NO 8365977
SERIAL NO

13557925

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.

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Patent Owner(s)

  • KULICKE AND SOFFA INDUSTRIES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeAngelis, Dominick A Villanova, US 19 320
Schulze, Gary W Bethlehem, US 3 42

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