Substrate treatment method, coating film removing apparatus, and substrate treatment system
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United States of America Patent
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Feb 5, 2013
Grant Date -
Oct 6, 2011
app pub date -
Jun 15, 2011
filing date -
Jan 22, 2007
priority date (Note) -
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Abstract
According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.
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