Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
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United States of America Patent
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Feb 5, 2013
Grant Date -
Sep 16, 2010
app pub date -
Oct 15, 2009
filing date -
Mar 12, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the present invention are directed to metallic solderability preservation coating on connectors of semiconductor package to prevent oxide. Singulated semiconductor packages can have contaminants, such as oxides, on exposed metal areas of the connectors. Oxidation typically occurs on the exposed metal areas when the semiconductor packages are not stored in appropriate environments. Copper oxides prevent the connectors from soldering well. An anti-tarnish solution of the present invention is used to coat the connectors during sawing, after sawing, or both of a semiconductor array to preserve metallic solderability. The anti-tarnish solution is a metallic solution, which advantageously allows the semiconductor packages to not need be assembled immediately after fabrication.
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