Partitioned through-layer via and associated systems and methods
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United States of America Patent
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Feb 5, 2013
Grant Date -
Jan 27, 2011
app pub date -
Oct 6, 2010
filing date -
Aug 31, 2007
priority date (Note) -
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Abstract
Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole.
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