Electromechanical devices having etch barrier layers
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United States of America Patent
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Feb 5, 2013
Grant Date -
Dec 31, 2009
app pub date -
Jun 22, 2009
filing date -
Sep 20, 2002
priority date (Note) -
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Abstract
In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the micro electromechanical systems device.
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