Shielded stacked integrated circuit packaging system and method of manufacture thereof
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United States of America Patent
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Feb 5, 2013
Grant Date -
Dec 8, 2011
app pub date -
Aug 17, 2011
filing date -
Dec 22, 2006
priority date (Note) -
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Abstract
A method of manufacture of a shielded stacked integrated circuit packaging system includes: forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.
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