Solderable top metalization and passivation for source mounted package

United States of America Patent

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Feb 5, 2013
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Nov 5, 2004
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Mar 11, 2004

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Abstract

A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.

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Patent Owner	Address
INFINEON TECHNOLOGIES AMERICAS CORP	101 N SEPULVEDA BLVD EL SEGUNDO CA 90245

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

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Inventor Name	Address	# of filed Patents	Total Citations
Carroll, Martin	Cardiff Wales, GB	10	162
Elwin, Matthew P	Swansea, GB	4	74
Jones, David P	South Glamorgan, GB	105	4700
Sawle, Andrew	West Sussex, GB	9	118
Standing, Martin	Kent, GB	96	2006
Wagstaffe, Ian Glenville	Gwent, GB	3	68

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Solderable top metalization and passivation for source mounted package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10982965

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US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 05, 2013	US,8368211,B2 US8368211B2	GRANTED PATENT AS SECOND PUBLICATION
September 15, 2005	US,20050200011,A1 US20050200011A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	8368211
SERIAL NO	10982965
DOCKET NO

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10982965

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