Apparatus and methods related to the packaging and cabling infrastructure of a distributed switch fabric
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United States of America Patent
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Feb 5, 2013
Grant Date -
Oct 6, 2011
app pub date -
Apr 1, 2010
filing date -
Apr 1, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
In some embodiments, a system includes a chassis having a group of horizontal slots in which a first group of line cards is disposed and a group of vertical slots in which a second group of line cards is disposed. Each port of a line card from the first group of line cards is operatively coupled to a different line card from the second group of line cards when the system is in a first configuration. A first set of ports and a second set of ports of a line card from the first group of line cards are operatively coupled to a first line card and a second line card from the second group of line cards, respectively, when the system is in a second configuration.
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