Hearing assistance device with stacked die
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United States of America Patent
Stats
-
Feb 5, 2013
Grant Date -
Jun 24, 2010
app pub date -
Dec 19, 2008
filing date -
Dec 19, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present subject matter relates to a hearing assistance device for an ear of a wearer comprising a microphone for receiving sound, hearing assistance electronics in communications with the microphone, the hearing assistance electronics including a hybrid circuit, and a wearable housing adapted to house at least the hearing assistance electronics. The hybrid circuit comprises a first integrated circuit die having one or more through-silicon-vias (TSVs), a first redistribution layer disposed on a surface of the first integrated circuit, and a second integrated circuit die having one or more contacts, the second integrated circuit die disposed on the first redistribution layer, wherein the first redistribution layer is adapted to connect one or more of the one or more TSVs of the first integrated circuit die to one or more of the one or more contacts of the second integrated circuit die.
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Family
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