Resin solidification substrate and assembly

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United States of America Patent

PATENT NO 8372330
APP PUB NO 20110089610A1
SERIAL NO

12907853

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Abstract

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A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section.

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Patent Owner(s)

Patent OwnerAddress
SPRINTRAY INC2705 MEDIA CENTER DRIVE SUITE #1 LOS ANGELES CA 90065

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
El-Siblani, Ali Dearborn Heights, US 58 4378
Shkolnik, Alexandr Los Angeles, US 44 2972

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