Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
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United States of America Patent
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Feb 19, 2013
Grant Date -
Nov 15, 2007
app pub date -
Oct 5, 2005
filing date -
Oct 27, 2004
priority date (Note) -
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Abstract
A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.
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