Printed circuit board and method for fabricating the same
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United States of America Patent
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Feb 19, 2013
Grant Date -
Feb 17, 2011
app pub date -
Sep 21, 2009
filing date -
Aug 17, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides a printed circuit board and method for fabricating the same. The printed circuit board includes a substrate having an internal circuit structure. An additional circuit structure is disposed on the substrate, electrically connected to the internal circuit structure. A solder mask insulating layer having an opening is disposed on the additional circuit structure. A conductive bump pattern is disposed in the solder mask insulating layer, wherein the conductive bump pattern extends into the opening horizontally, wherein a side, a portion of an upper surface and a portion of a lower surface of the conductive bump pattern are exposed from the opening. A solder ball is formed in the opening, wherein the solder ball is electrically connected to the additional circuit structure.
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