Manufacturing method and structure of a wafer level image sensor module with package structure
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United States of America Patent
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Feb 19, 2013
Grant Date -
Oct 6, 2011
app pub date -
Jan 21, 2011
filing date -
Apr 6, 2010
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.
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