Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts
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United States of America Patent
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Feb 19, 2013
Grant Date -
May 24, 2012
app pub date -
Nov 24, 2010
filing date -
Nov 24, 2010
priority date (Note) -
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Abstract
The microelectronic assembly includes a first microelectronic element having a front surface, a plurality of contacts exposed at the front surface, and a rear surface remote from the front surface; a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond an edge of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at its front surface; a dielectric region overlying the front surfaces of the microelectronic elements, the dielectric region having a major surface facing away from the microelectronic elements; metallized vias within openings in the dielectric region extending from the plurality of contacts of the first and second microelectronic elements; and leads extending along a major surface of the dielectric region from the vias to terminals exposed at the major surface.
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