Manufacture of high strength, high density carrier plate
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United States of America Patent
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Feb 26, 2013
Grant Date -
Aug 19, 2010
app pub date -
Feb 19, 2009
filing date -
Feb 19, 2009
priority date (Note) -
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Abstract
A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.
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