Method of bonding porous metal to metal substrates
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United States of America Patent
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Feb 26, 2013
Grant Date -
Apr 14, 2011
app pub date -
Oct 8, 2009
filing date -
Oct 8, 2009
priority date (Note) -
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Abstract
A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.
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