Method and apparatus for laser singulation of brittle materials
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United States of America Patent
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Feb 26, 2013
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N/A
app pub date -
Apr 2, 2010
filing date -
Apr 2, 2010
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Abstract
An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.
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