Methods for forming small-scale capacitor structures

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United States of America Patent

PATENT NO 8384192
SERIAL NO

13047430

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides small scale capacitors (e.g., DRAM capacitors) and methods of forming such capacitors. One exemplary implementation provides a method of fabricating a capacitor that includes sequentially forming a first electrode, a dielectric layer, and a second electrode. At least one of the electrodes may be formed by a) reacting two precursors to deposit a first conductive layer at a first deposition rate, and b) depositing a second conductive layer at a second, lower deposition rate by depositing a precursor layer of one precursor at least one monolayer thick and exposing that precursor layer to another precursor to form a nanolayer reaction product. The second conductive layer may be in contact with the dielectric layer and have a thickness of no greater than about 50 Å.

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Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Basceri, Cem Cary, US 325 10555
Beaman, Kevin L Boise, US 46 1506
Breiner, Lyle D Meridian, US 42 1612
Doan, Trung T Vallejo, US 253 14083
Kubista, David J Nampa, US 21 1790
Ping, Er-Xuan Meridian, US 224 3186
Weimer, Ronald A Boise, US 113 2880
Zheng, Lingyi A Manassas, US 64 1826

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