Semiconductor device, circuit board, and electronic instrument
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United States of America Patent
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Feb 26, 2013
Grant Date -
Jul 9, 2009
app pub date -
Mar 6, 2009
filing date -
Dec 4, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device (150) has a semiconductor chip provided with electrodes (158), a resin layer (152) forming a stress relieving layer provided on the semiconductor chip, wiring (154) formed from the electrodes (158) to over the resin layer (152), and solder balls (157) formed on the wiring (154) over the resin layer (152); the resin layer (152) is formed so as to have a depression (152a) in the surface, and the wiring (154) is formed so as to pass over the depression (152a).
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