Electrostatic bonding of a die substrate to a package substrate
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United States of America Patent
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Feb 26, 2013
Grant Date -
Apr 26, 2012
app pub date -
Oct 20, 2010
filing date -
Oct 20, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
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