Method and apparatus for cooling electronic enclosures
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United States of America Patent
Stats
-
Mar 5, 2013
Grant Date -
Aug 17, 2006
app pub date -
Mar 14, 2006
filing date -
Mar 21, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An enclosure containing heat-producing equipment includes an air inlet for admitting air from an environment containing the enclosure. The equipment is situated relative to the air inlet such that the air absorbs heat from the equipment, increasing the temperature of the air. An air-to-liquid heat exchanger is mounted on an outside surface of the enclosure adjacent to an air outlet. The heat exchanger is connectable to an external cooling source such that heat from the heated air exiting the enclosure absorbed by the heat exchanger is expelled outside the environment containing the enclosure.
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